Spouted Bed Electrode Plating

AEP invested in spouted bed electrode plating technology to address the continuing miniaturization of electronic parts. The process utilizes a solution jet that circulates the parts throughout the plating chamber.


Spouted bed electrode plating technology is an effective tool for plating parts that are smaller than 1 cm in any single dimension. This process has been very helpful in achieving uniform plating thicknesses and enhanced ID coverage.